an abstract photo of a curved building with a blue sky in the background

Turnkey PCB Manufacturing & Assembly

End-to-end fabrication and high-precision component assembly for rugged electronic systems.

01. Production Capabilities

  • Raw PCB Fabrication (Mfg): Quick-turn manufacturing of rigid, flexible, and dense multi-layer (4 to 12+ layers) substrates with custom layer stackups, precision drilling, and advanced surface finishes.

  • Surface Mount Technology (SMT): High-precision, automated board population and placement of fine-pitch components, complex BGAs, QFNs, and micro-scale passive arrays.


  • Turnkey Component Sourcing: End-to-end logistics and parts procurement handled exclusively through authorized global distributors to eliminate lead-time conflicts and counterfeit component risks.


  • Rigid Quality Inspection: Complete visual auditing and multi-angle Automated Optical Inspection (AOI) to guarantee defect-free solder joints before hardware validation.


02. Standards & Compliance

  • Workmanship Matrix: Full fabrication and assembly compliance with IPC-A-610 Class 2 (Standard Industrial) and Class 3 (High-Reliability/Automotive) production guidelines.


  • Environmental Profile: Lead-free processing options and RoHS-compliant manufacturing pipelines built for global regulatory standards.


03. Manufacturing Deliverables Package

  1. Assembled Hardware: Fully populated, chemically cleaned, and physically verified target units ready for immediate deployment.


  2. Quality & Test Logs: Detailed physical inspection sheets and automated optical inspection (AOI) verification logs.


  3. Traceability File: Certified As-Built Bill of Materials (BOM) containing exact component tracking numbers and factory date codes.

S32K144 SmartWheels Micro EV2

Manufacturing Profile: Precision multi-layer fabrication of a breadboard-compatible 71-GPIO form factor. Production involves fine-pitch automated SMT placement for the NXP automotive MCU, integrated decoupling networks, onboard Segger J-Link debugger routing, and switchable 3.3V/5V logic power domains.

Recent Projects Snapshots

Single Cell BMS V2

Manufacturing Profile: High-reliability fabrication and assembly of an ultra-compact Battery Management System (BMS). Features precise automated placement of low-resistance MOSFETs, high-accuracy current-sense resistors, and dedicated protection ICs engineered for optimal thermal dissipation and stable cell balancing.

SmartWheels V1 Pro VCU

Manufacturing Profile: Heavy-copper, high-density multi-layer substrate fabrication built to withstand rugged automotive environments. Fully automated SMT line assembly populates the NXP automotive chipset, the dual-threaded ESP32 gateway core, multi-rail ADC monitoring circuits, and robust reverse-polarity protection logic.

Contact

Reach us for precise PCB design help.

© 2025. All rights reserved.

2181 Sector 28, Faridabad,
Haryana 121008.
Contact : +91 9899977637, 7982725030
Email : contact@ubyte.in, contact.ubyte@gmail.com

Our other active website

Navigation